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Europas Halbleiter-Experten kommen im Juni zum Semi-Gipfel nach Dresden, um über neue Trends in der 3D-Integration von Chip zu debattieren.
https://oiger.de/2024/03/30/3d-chipintegration-als-trendtechnologie-fuer-europas-halbleiter-renaissance/190378
#Semiconductor #3D #2_5D #Halbleiter #chiplet #hybrid #bonding #TSV #TSMC #Intel #Samsung #Leti #imec #nvidia #Sachsen #Saxony #Dresden #Mikroelektronik #CPO #package
Oiger · 3D-Chipintegration als Trendtechnologie für Europas Halbleiter-Renaissance - OigerHunderte Halbleiter-Experten kommen im Juni zum Semi-Gipfel nach Dresden, um über neue Trends in der 3D-Integration von Chip zu debattieren.